METHOD FOR RECYCLING PRINTED CIRCUIT PLATES (MACHINE-TRANSLATION BY GOOGLE TRANSLATE, NOT LEGALLY BINDING)

Patent number:

ES2739880

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Method for recycling printed electronic circuit boards comprising the following steps: obtaining fragments of a printed electronic circuit board with a size less than 10 mm: mixing the fragments of the printed circuit boards with a liquid with a density between 1 and 2.8 grams per cubic centimetre, stir the mixture obtained in the previous stage by applying ultrasound: and separate the different fractions produced in the previous stage. As well as a method of recovering metals of this type of plates comprising the recycling method mentioned above. (Machine-translation by Google Translate, not legally binding)

Countries:
Spain
Regions:
Community of Madrid
Centers:
UNIVERSIDAD POLITECNICA DE MADRID
Other entities:
Sectors:
Telecom
Circular Economy
Energy
Subsectors:
Materials, metallurgy, Y02P10/20, Y02W30/82
TRL Level:
TRL 4 – technology validated in lab
BRL Level:
BRL2: First business concept described market potential & competitive overview
PDF Link:
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Video Link:
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Sustainable Development Goal:
SDG09: Industry, innovation and infrastructure
Applications

The main advantage of the technology developed by UPM research group is the decrease in the content of plastics and fibers in wastes from printed electronic circuit boards. This technology facilitates the subsequent recovery of the metals present in these wastes, mainly Cu, Au, Ag and platinides, using classical mineralurgical, pyrometallurgical or hydrometallurgical processes.

Comments

The technology of the present invention minimizes the technical and environmental problems that currently exist in the recovery processes of metals present in the wastes from printed electronic circuits boards.

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