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THERMOSET CURING THROUGH RESISTIVE HEATING OF NANOCARBONS
Patent number:
ES2554402
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The invention relates to an in situ thermoset curing process. The curing process is based on the formation of a nanocarbon conducting thermoset and resistive heating. Furthermore, the invention relates to process for in situ repairing composites and a process for soldering based on the thermoset curing process through resistive heating.
Countries:
Spain
Regions:
Community of Madrid
Centers:
FUNDACION IMDEA MATERIALES, FUTURE FIBRES RIGGING SYS S L, FUTURE FIBRES RIGGING SYSTEMS SL
Other entities:
Sectors:
Aerospace
Subsectors:
Other special machines, Macromolecular chemistry, polymers, Basic materials chemistry, Electrical machinery, apparatus, energy
TRL Level:
TRL 4 – technology validated in lab
BRL Level:
BRL1: Hypothesizing on possible business concept
PDF Link:
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Watch it hereSustainable Development Goal:
SDG09: Industry, innovation and infrastructure
Applications
- Reduction in power/energy used to cure thermosets - Reduction in curing time - Suitable for repair of structural elements with minimum intervention - The conductive filler reduces polymer “bleeding” when used as an adhesive.
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